Advanced Oxide Etch Tool

The Vendor is required to provide for an advanced oxide etch tool for inductively coupled plasma etching of fused silica wafers with photoresist masks:
•    The system must be tooled for 100 mm fused silica wafers with a standard wafer flat.
•    The system must have a vacuum-compatible load-lock for transferring substrates into and out of the process chamber.
•    The process chamber must include a mechanical substrate clamp with helium backside cooling to ensure effective thermal management, thereby eliminating surface roughness on the etched wafer.
•    The system must have a heated chamber and chamber liner to minimize process deposition, with a maximum temperature of 60 °C.
•    Backside helium pressure must be at least 10 Torr and managed so that fused silica wafer thickness from 0.5 mm to 1 mm thickness can be accommodated.
•    The lower electrode must be temperature-controlled, -20 °C to +60 °C, for substrate heating/cooling.
•    The system must have at least 2000 W ICP power at 2 MHz with an impedance matching network.
•    The system must have at least 300 W Bias power (RIE) at 13.56 MHz with an impedance matching network.
•    The system must have a minimum of 8 gas lines for O₂, CHF₃, C4F8, Ar, CF₄, SF₆, and N2 with high-precision Mass Flow Controllers (MFCs).
•    The system must have a demonstrated tunable etch selectivity for 1 mm-thick 100 mm-diameter fused silica wafers using O2/CHF3 gases (SiO₂:resist) from 0.2:1 to 2:1 with minimal surface roughness to provide optical quality transmissive optics.
•    The etch uniformity must be < ±2.5% across 100 mm fused silica wafer.
•    The chamber pressure must be 5 - 100 mTorr (closed-loop control).
•    The system must have a control PC for operation, data management handling, and remote system operation.
•    The system must have a delivery date within 6 months from time of purchase.
•    New equipment only.
•    Price must include shipping and delivery.
•    A warranty of at least one year must be included.
•    Installation and training must be included in the package.
•    Software with suitable number of licenses (if applicable) must be included.

- Contract Period/Term: 1 year
- Questions/Inquires Deadline: August 14, 2025