Physical Vapor Deposition System

The Vendor is required to provide physical vapor deposition system for include:
• Process substrates from 1 cm x 1 cm pieces up to 6-inches diameter wafer.
• Three thermal evaporation sources with shutters and power supplies (or controllers) for sequential and co-deposition of 2 sources.
• Three magnetron sputtering sources for 2-inch or 3-inch targets, including:
• One high-strength source for deposition of magnetic materials
• Two dc power supplies
• Power supply switch for sequential and co-deposition
• Three source shutters
• Substrate stage to accommodate one 6-inch substrate or smaller pieces, including:
• Rotation with variable speed
• Pneumatically actuated substrate shutter
• Adjustable source to substrate distance, manual or motorized.